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Potting & Encapsulation

Production PottingEncapsulationPotting consists of immersing the part or assembly in a liquid resin, and then curing it. Although often confused for each other, potting is different from encapsulation in that it retains the shell that is used to contain the thermoset resin while it’s curing.

Encapsulation involves building a mold or frame around an object, e.g., wires, filling the space between the frame and the object with a thermosetting material such as Di-Pak, waiting for the resin to cure, and then removing the frame.

These processes are commonly employed to protect semiconductor components from moisture and mechanical damage. They are also used in high voltage products to allow live parts to be placed much closer together, so that the product can be smaller. They keep dirt and conductive contaminants such as impure water out of sensitive areas and serve as structural reinforcement, protecting sonar transducers and other deep submergence items from collapsing under extreme pressure. Potting with black or opaque epoxies and polyurethanes can be used to discourage reverse engineering of proprietary products such as printed circuit modules.

Ultraclear Embedded InsectEncapsulation can also be used as a way to display or preserve delicate items such as insects, flowers, stamps, coins, and other collectables. Hapco’s Ultraclear is well suited to these applications because of its crystal clear appearance and gel times ranging from 5 to 900 minutes.
Clear Potted Electronics

When void-free potting and encapsulating is desired, place the product in a Molding Chamber while the resin is still liquid. Next, apply 70-80 PSI to collapse the voids and force the liquid resin into all internal spaces, then release pressure and remove the part once it’s cured.

 

Potting and Encapsulating Materials

Di-Pak™ – Dielectric Packaging compounds with a wide range of properties and gel times.

Sympoxy™ 1960/1961G - Heat cure epoxy powder that is lightweght and passes 94 V-0 testing.

Ultraclear™ – Crystal clear casting resins with a low viscosity, great properties and a wide range of gel times.

Hapflex™ 700/800 Series – Colorless/clear polyurethane elastomers with excellent adhesion properties.


Equipment

RAPIDFIL™ - LCD / computer controlled, 2 component, dispensing equipment.

MINIFIL™ - Low cost, 2 component, portable, dispensing equipment.

RAPIDSHOT™ – Handheld cartridge dispensing system for 1:1, 2:1, and 4:1 ratios.

X-11 Molding Chamber – Ergonomically designed pressure and curing chamber for parts and molds.