Di-Pak™ Rigid

To view datasheets and processing notes, click the image to the right.

DI-PAK R-4525
A general purpose series of low viscosity, strong, potting and encapsulating compounds. DI-PAK R-4525 has excellent electrical insulating properties and bonds well to many substrates. By varying the curing agents, the desired cure and working life can be obtained.

DI-PAK R-4528
A black, flame retardant, thermally conductive, high performance series that can be used in all types of electrical components. Combined with its ability to dissipate heat, DI-PAK R-4528 also provides low linear thermal expansion, low shrinkage, and low exothermic heat while curing. Meets UL requirements.

DI-PAK R-4545
A very low viscosity potting and encapsulating system with excellent flow and penetration into the most intricate electronic components, without voids or porosity. The R-4545 Series cure to a hard, shiny, high gloss, plastic finish that is free from “blushing” under all humidity conditions. The R-4545 Series is ideal for electrical applications where surface finish and appearance are critical.

DI-PAK RIGID PRODUCTS

DI-PAK R-4307
A very low viscosity potting and encapsulating system with excellent flow and penetration into the most intricate electronic components, without voids or porosity. The R-4545 Series cure to a hard, shiny, high gloss, plastic finish that is free from “blushing” under all humidity conditions. The R-4545 Series is ideal for electrical applications where surface finish and appearance are critical.

DI-PAK R-4200
A low viscosity, long working life compound designed for potting/encapsulating units requiring high physical strength, and excellent penetration & adhesion to components. DI-PAK R-4200 holds its mechanical & electrical properties while under the most severe conditions, due to its low water absorption, and retention of strength at elevated temperatures.

DI-PAK R-4354
A 100% solids, room temperature cure, dielectric insulating material used for sealing, coating, bonding and potting. R-4354 is a medium viscosity, slightly thixotropic system.

DI-PAK R-4806 & R-4807 A/B
Low viscosity, fast cure, high performance, potting and encapsulating compounds with excellent properties and FAST TURNOVER. Both are two part systems with 1:1 mix ratios by volume.

DI-PAK R-4242/4243
Low cost, fast set potting compounds with excellent properties and FAST TURNOVER. R-4242/4243 are 1:1 by weight or volume, making them ideal for hand pour or automatic metering systems.

DI-PAK R-4912 & R-4260 A/B
Low viscosity, fast cure, high performance, high HDT potting and encapsulating compounds with excellent properties and FAST TURNOVER. Both are two part systems with 1:1 mix ratios by volume.

DI-Coat R-Series
DI-COAT R-4721 / DI-COAT R-4721 LV (lower viscosity)
Shore 90 D, room temperature curing, medium to high thixotropic coating for dielectric insulating applications.

DI-COAT R-4721 is ideal for use on vertical or sloping surfaces where flow or drain-off cannot be tolerated.

DI-COAT R-4721 is easy to use, and should be used on insulating applications where conformal coating is required.

DI-COAT R-4721 LV exhibits similar characteristics to DI-COAT R-4721, but has a lower viscosity.